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非常精准、可重复、可追溯、快速且灵活的光子集成电路（PIC）测试
Accurate,automated,fasttestingofphotonicintegratedcircuits(PIC)withtraceableresults.
OPAL-EC 先进的晶圆级端面耦合测试台|EXFO (在产)
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EXFO · EXFO Inc.
OPAL-EC 先进的晶圆级端面耦合测试台
Device under test Single die up 至 12-in waf… · Work area Ф300 mm · Coupling mode Surface and edge coupling
产品简介
精准、灵活、快速地测试光子集成电路（PIC），提供可追溯的测试结果。
核心参数
• Device under test（DUT）：Single die up 至 12-in wafer
• Work area（OPAL-EC）：Ф300 mm
• Coupling mode：Surface and edge coupling
• Alignment：Full automated
• Chuck（OPAL-EC in OPAL series overview）：Ambient or 0 ℃ 至 200 ℃ (32 ℉ 至 392 ℉); 4 vacuum zones
• Rotation base stage（OPAL-EC in OPAL series overview）：Motorized rotation: 105°
• Probe configuration：Optical and electric probes, up 至 4
功能与特点
• 完整的PIC测试平台，用于精确、可重复的光学准直和电气检测。
• 利用随附的 PILOT 软件套件进行准备、自动执行（准直、仪表控制）和数据管理（存储、分析）。
• 根据需要提供不同的探针头供用户选择：光探针头有多达 6 个电动轴，用单纤或光纤阵列进行垂直和端面耦合；电探针头配备手动或电动轴。
• 光探针头和基座运动系统的可重复性一流。
• 业内首个晶圆级多端口端面耦合测试解决方案。
• 使用同一个测试台进行晶圆、切割后晶圆、多裸片或Bar条测试。
典型应用
• 从研发、设计验证和工艺开发到早期生产和制造
• 在集成光子平台进行光电测试：硅光子器件、磷化铟、III-V、聚合物、异质等。
• 深入分析统计电路性能和良率。
• 与DUT无关：可测试单个至数十个的裸片、光罩、定制切割件、Bar条以及12英寸晶圆。
• 与应用无关：电信和数据通信光模块、量子、激光雷达、传感器、人工智能，用单纤或光纤阵列进行垂直和端面耦合，涵盖从原型设计到试产的整个流程
资源下载
• 详细指标：全部技术指标已单独整理，详见 OPAL-EC 先进的晶圆级端面耦合测试台 详细指标页
onetest仪器资源库 · EXFO OPAL-EC 先进的晶圆级端面耦合测试台
EXFO · EXFO Inc.
OPAL-EC 先进的晶圆级端面耦合测试台 · 详细指标
Device under test Single die up 至 12-in waf… · Work area Ф300 mm · Coupling mode Surface and edge coupling
产品简介
精准、灵活、快速地测试光子集成电路（PIC），提供可追溯的测试结果。
本页按官方规格资料分组收录 OPAL-EC 先进的晶圆级端面耦合测试台 的全部关键技术指标；产品定位、特性与应用场景请见 OPAL-EC 产品介绍页。
技术指标
技术规格
• Wafer positioning stage - XY axis（OPAL-EC-300）：Travel range: 300 mm; Resolution: 0.003 μm; Accuracy: 0.75 μm; Bi-directional repeatability: 0.1 μm; Maximum process speed: 100 mm/s; Orthogonality: 1 arcsec; Motor type: Direct-drive linear motors, noncontact encoder
• Wafer positioning stage - Z axis（height）：Travel range: 5 mm; Resolution: 0.0008 μm; Accuracy: 1.5 μm; Bi-directional repeatability: 0.3 μm; Maximum speed: 4 mm/s; Motor type: Direct-drive brushless linear motor
• Wafer positioning stage - Rz axis（wafer rotation）：Travel range: 105°; Resolution: 0.36 arcsec; 0.0001°; Accuracy: 80 arcsec; 0.02°; Repeatability: 3 arcsec; 0.0008°; Maximum speed: 600 rpm; Motor type: Direct-drive brushless rotary motor, mechanical bearing
• Chuck options：TA-G: Range (℃) (ambient); 300-mm round chuck with 4 concentric vacuum zones; Electrical surface: grounded TH5-G: Range (℃) 0 - 150; Resolution (℃) 0.01; Stability (℃) ±0.05 (> 25) and ±0.1 ( TH5-F: Range (℃) 0 - 150; Resolution (℃) 0.01; Stability (℃) ±0.05 (> 25) and ±0.1 (< 25); Heating rate: 40 ℃/min; Cooling rate: –5 ℃/min; Surface flatness: < 25 μm; 300-mm round chuck with 4 concentric vacuum zones; Electrical surface: floating coaxial (triaxial as option)
• Top vision system - mechanical base holder：Mounting: Compatible with metric and imperial optical breadboard, at 90° and 45°; X, Y, Z axis travel range: 48 mm; X, Y axis displacement/revolution: 1.41 mm; Z axis displacement/revolution: 0.3175 mm
• Top vision system - vision：Magnification: 10 X; Numerical aperture: 0.28; Depth of field: 3.6 μm; Horizontal field of view: 0.88 mm; Working distance: 34 mm; Resolution: 2.9 MP; Maximum frame rate: 144 fps; Sensor format: 2/3 inch; Sensor type: Color, global shutter, 12 bit; Wavelength: visible; Illumination type: In-line through video microscope unit, LED illuminator
• Side vision system - mechanical base holder：Mechanical positioning: 6D manual coarse adjustment with articulated arm, XY manual translation stage; Mounting: Compatible with metric and imperial optical breadboard, at 90° and 45°; X, Y axis travel range: 48 mm; X, Y axis displacement/revolution: 1.41 mm
• Side vision system - vision：Lens type: telecentric; Magnification (X): 3; Numerical aperture: 0.093; Field of view: 2.9 × 2.2 mm; Working distance: 65 mm; Wavelength range: visible; Resolution: 2.9 MP; Maximum frame rate: 144 fps; Sensor format: 2/3 inch; Sensor type: Color, 12 bit, global shutter; Wavelength: visible
• Optical head options（PRO-H / PRO-S / PRO-ECO）：Motorized axes: X, Y, Z, Rx, Ry, Rz (for all options, with configuration-dependent details) Configuration: PRO-H – parallel hexapod, piezo; PRO-S – serial stack, DC servo; PRO-ECO – serial stack, screw X axis travel (mm): PRO-H 20; PRO-S 25; PRO-ECO 25 Y axis travel (mm): PRO-H 11; PRO-S 25; PRO-ECO 25 Z axis travel (mm): PRO-H 20; PRO-S 4.8; PRO-ECO 12.5 X axis resolution (nm): PRO-H 1; PRO-S 10; PRO-ECO 200 Y axis resolution (nm): PRO-H 1; PRO-S 10; PRO-ECO 200 Z axis resolution (nm): PRO-H 1; PRO-S 60; PRO-ECO 25 X axis repeatability (nm): PRO-H unidirectional 50, bidirectional 70; PRO-S bidirectional 1250; PRO-ECO bidirectional 1250 Y axis repeatability (nm): PRO-H unidirectional 50, bidirectional 70; PRO-S bidirectional 1250; PRO-ECO bidirectional 1250 Z axis repeatability (nm): PRO-H unidirectional 50, bidirectional 250; PRO-S bidirectional 125; PRO-ECO bidirectional 125 Rx axis travel (°): PRO-H 23; PRO-S 10; PRO-ECO 10 Ry axis travel (°): PRO-H 38; PRO-S 10; PRO-ECO 10 Rz axis travel (°): PRO-H 26; PRO-S 10; PRO-ECO 10 Rx, Ry, Rz axis resolution (arcsec): PRO-H 0.04; PRO-S 4; PRO-ECO 4 Rx, Ry, Rz axis repeatability (arcsec): PRO-H unidirectional 1.5; PRO-S 7; PRO-ECO 7 Full virtual pivot point: PRO-H yes; PRO-S no; PRO-ECO no Orientations: North/East/South/West (all options); Included: fiber holder (all options)
• Electrical head options（PRE-00 / PRE-MO）：Translation stages type: PRE-00 manual; PRE-MO motorized X, Y, Z with manual probe angle X, Y axis travel range (mm): PRE-00 48; PRE-MO 50 Z axis travel range (mm): PRE-00 48; PRE-MO 25 X, Y, Z axis resolution (nm): PRE-MO 100 X, Y, Z axis repeatability (μm): PRE-MO 1, bidirectional, typical 0.3 X, Y, Z axis accuracy (μm): PRE-00 typical 2; PRE-MO 5 X, Y, Z axis speed (mm/s): PRE-MO 5 X, Y, Z axis displacement/revolution (mm/rev): PRE-00 0.3 Tilt travel: 10° (both options); Rail system × travel: PRE-00 180 mm; PRE-MO 160 mm; Z coarse step travel (mm): PRE-00 min 6.35, max 56; PRE-MO min 12.5, max 100
a. Other temperature ranges available upon request. b. Other electrical surface options available upon request. a. Optical probes (fiber array, fiber) and electrical probes (DC, RF) are not included in the system. If these components are required, please contact an EXFO representative. a. Other magnifications options (0.5X, 1X, 2X, 4X, 6X, 8X) available upon request. b. Other working distances options (40 mm, 110 mm) available upon request. a. Other optical options and configurations are available upon request. b. Various configurations are available. X, Y, Z are always motorized and angles can be motorized, up to all 6 axes. Specifications here are for all motorized axes, travel may differ for manual version. c. Multiple options are available for surface and edge coupling configuration, multiple angles available.
通用规格
• Device under test（DUT）：Single die up 至 12-in wafer
• Work area（OPAL-EC）：Ф300 mm
• Coupling mode：Surface and edge coupling
• Alignment：Full automated
• Chuck（OPAL-EC in OPAL series overview）：Ambient or 0 ℃ 至 200 ℃ (32 ℉ 至 392 ℉); 4 vacuum zones
• Rotation base stage（OPAL-EC in OPAL series overview）：Motorized rotation: 105°
• Probe configuration：Optical and electric probes, up 至 4
• Compatible wafer size：Up 至 12 in (300 mm) wafers; also suitable for single dies, bars and multiple dies using adapter plates
• OPAL-EC main system - chuck：Aluminum surface, ground polished, ambient temperature, chuck with 4 vacuum zones; electrical surface connection options; thermally controlled chuck with heating and cooling capabilities, range from 0 ℃ 至 150 ℃, 4 vacuum zones
• OPAL-EC main system - wafer positioning base stage：High accuracy, 4° of freedom wafer positioning with possibility 至 rotate a wafer by 105°; 300 mm (12-in) diameter chuck and XY travel range
• OPAL-EC main system - vision system：Top high-resolution video system with 10X magnification using in-line coaxial illumination and 2.9 MP color camera on XYZ manual adjustment; side view 2.9 MP color camera with 3X telecentric magnification on XY manual adjustment
• Additional accessories：Industrial rackmount PC and accessories (KMV), two 27-in monitors; free-standing workstation; top enclosure
• EXFO Pilot software - dedicated license：Full software suite for complete test and measurement flow of PIC; automation and control of test station, instruments and data for absolute traceability and reliability of results that are report-ready and AI-ready; additional floating licenses available for multi-user collaboration from anywhere
• Electrical probes（general description）：4-axis manual electrical probe positioners for fine alignment and long travel range; probe holders compatible with most DC and RF probes (PRE-00 manual, PRE-MO motorized with 200 nm resolution)
• Optical probes（general description）：Motorized 6-axis nanometer-precision, piezo-based hexapod for precise and fast operation for edge coupling and surface coupling; features virtual pivot point for optimization of injection angle during automated coupling; includes a clamp 至 fit most fiber arrays and a slider/manual screws concept 至 toggle between engaged/disengaged positions
a. Optical probes (fiber array, fiber) and electrical probes (DC, RF) are not included in the system. If these components are required, please contact an EXFO representative.
注：以上指标摘自 EXFO 官网公开产品规格资料，未特别说明均为典型值；指标可能随硬件与软件版本变化，恕不另行通知。官方规格书中以字母标注的脚注（测试条件）未在本页展开，完整条件请以原规格书为准。
onetest仪器资源库 · EXFO OPAL-EC 先进的晶圆级端面耦合测试台 详细指标
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EXFO官方渠道
官方渠道（官网 / 热线 / 邮箱）
• 爱科斯福通信技术（北京）有限公司
• 地址
北京市朝阳区北四环中路27号院5号楼钰珵大厦30层06-09室（邮编 100101）
• 电话 +86-10-8950 8858
• 免费电话 +86-400-610-6999
• 传真 +86-10-89508855
全国办事处
深圳分公司与工厂
• 爱科斯福通信技术（北京）有限公司深圳分公司
• 地址
深圳市南山区粤海街道高新区社区高新南七道138号惠恒大楼一期4楼4226（邮编 518063）
• 电话
+86-755-8203-2300
传真：+86-755-8203-2306
• EXFO Telecom Equipment (Shenzhen) Ltd.
• 地址
广东省深圳市宝安区福海街道新田社区新田大道71-3号 F1–F3（邮编 518103）
• 电话 +86-755-29553100
• EXFO 公司总部
400 Godin Avenue, Quebec, Quebec G1M 2K2, Canada
电话：+1 418-683-0211 免费电话：+1 800-663-3936
传真：+1 418-683-2170
• EXFO 协议业务部门（蒙特利尔）
2500 Boul. Alfred-Nobel, Saint-Laurent, Quebec H4S 0A9, Canada
电话：+1 514-856-2222 免费电话：+1 888-972-7666
• EXFO 芬兰
Elektroniikkatie 2, FI-90590 Oulu, Finland
电话：+358 (0) 403 010 300
• EXFO America Inc.
612 Spring Hill Drive, Suite 180, Spring, TX 77386-6045, USA
电话：+1 972-761-9271
• EXFO Europe Ltd.
Winchester House, School Lane, Chandlers Ford, SO53 4DG, UK
电话：+44-2380-246-800
• EXFO Asia Pacific PTE Ltd.
229 Mountbatten Road #02-26 Mountbatten Square, Singapore 398007
电话：+65-6333-8241
传真：+65-6333-8242
• 技术支持（中国）
电话：+86-10-8950 8858 免费电话 +86-400-610-6999
授权分销商
• Great Engineering Technology Corporation CO. LTD.（GETECH） 电话
0800-802-206
邮箱：service@getech.com.tw 网址：www.getech.com.tw
• NTS Technologies Limited 电话
+852-3184-0330
邮箱：office@nts-tech.com 网址：www.nts-tech.com
• WeiTECH Communication Co., Ltd. 电话：+886-2-2223-8800
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